Concepedia

Changsup Ryu

CR

Statistics

Publications

10

Citations

625

H-Index

10

Active since

1996

Affiliations

Stanford SystemX Alliance(Current)

Stanford University

Advanced Micro Devices (United States)

Integrated Systems Solutions (United States)

Hewlett-Packard (United States)

Changsup Ryu is an author at Stanford SystemX Alliance specializing in materials science, materials engineering, and electronic materials.

Publications per year

1996–2012

10

Publications

10

Microstructure and reliability of copper interconnects

Changsup Ryu, Kee-Won Kwon, Alvin L. S. Loke et al. · IEEE Transactions on Electron Devices · 1999 · 187 citations

Natural Sciences, Electrical Engineering, Materials Science +16

Thermal stability of a Cu/Ta multilayer: an intriguing interfacial reaction

Hoo-Jeong Lee, Kee-Won Kwon, Changsup Ryu et al. · Acta Materialia · 1999 · 111 citations

Natural Sciences, Materials Engineering, Materials Science +17

Kinetics of copper drift in PECVD dielectrics

Alvin L. S. Loke, Changsup Ryu, C. Patrick Yue et al. · IEEE Electron Device Letters · 1996 · 100 citations

Engineering, Electrical Engineering, Materials Science +17

Evidence of heteroepitaxial growth of copper on beta-tantalum

Kee-Won Kwon, Changsup Ryu, Robert Sinclair et al. · Applied Physics Letters · 1997 · 68 citations

Natural Sciences, Materials Engineering, Materials Science +17

Ultra-Low Resistance, Through-Wafer Via (TWV) Technology and Its Applications in Three Dimensional Structures on Silicon

H. Tom Soh, C. Patrick Yue, A.M. McCarthy et al. · Japanese Journal of Applied Physics · 1999 · 46 citations

Engineering, Electrical Engineering, Materials Science +17

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