Bonding

Bonding is the intentional electrical interconnection of conductive parts to establish a common potential, ensuring safety by preventing hazardous voltages and enabling effective fault current paths within a system or installation.

17.4K

Publications

922.8K

Citations

52.2K

Authors

6.1K

Institutions

Publications per year

2017–2026

3.9K

Authors

52.2K

  1. LW
    Lai‐Sheng Wang

    Washington State University, United States

    93 publications · 7.9K citations

    51

    h-index

  2. GF
    Gernot Frenking

    Philipps University of Marburg, Germany

    94 publications · 7.5K citations

    47

    h-index

  3. AI
    Alexander I. Boldyrev

    Utah State University, United States

    72 publications · 8.5K citations

    41

    h-index

  4. TS
    Tadatomo Suga

    The University of Tokyo, Japan

    78 publications · 3.7K citations

    34

    h-index

  5. HZ
    Hua‐Jin Zhai

    Shanxi University, China

    44 publications · 3.4K citations

    32

    h-index

1–5 of 52.2K

Venues

  1. Journal of the American Chemical Society

    JACS · 475 publications · 43.8K citations

    113

    h-index

  2. The Journal of Chemical Physics

    575 publications · 37.5K citations

    97

    h-index

  3. Physical review. B, Condensed matter

    PRB · 284 publications · 23.4K citations

    79

    h-index

  4. The Journal of Physical Chemistry A

    400 publications · 22.4K citations

    71

    h-index

  5. Inorganic Chemistry

    537 publications · 22.4K citations

    70

    h-index

1–5