Bonding
Bonding is the intentional electrical interconnection of conductive parts to establish a common potential, ensuring safety by preventing hazardous voltages and enabling effective fault current paths within a system or installation.
17.4K
Publications
922.8K
Citations
52.2K
Authors
6.1K
Institutions
Publications per year
2017–2026
3.9K
17.4K
Anomalous Lattice Vibrations of Single- and Few-Layer MoS<sub>2</sub>
1–5 of 17.4K
52.2K
51
h-index
47
h-index
41
h-index
34
h-index
32
h-index
1–5 of 52.2K
6.1K

Centre National de la Recherche Scientifique
Paris, France
74 h-index
1.5K publications
74.5K citations

Chinese Academy of Sciences
Beijing, China
62 h-index
1.2K publications
56K citations
The University of Tokyo
Tokyo, Japan
52 h-index
596 publications
26.8K citations
Philipps University of Marburg
Marburg, Germany
49 h-index
331 publications
23.4K citations
University of Wisconsin–Madison
Madison, United States
48 h-index
222 publications
18.5K citations
Massachusetts Institute of Technology
Cambridge, United States
48 h-index
255 publications
18.7K citations
University of California, Berkeley
Berkeley, United States
47 h-index
296 publications
24.8K citations
The University of Osaka
Osaka, Japan
47 h-index
629 publications
29.7K citations
1–8 of 6.1K
JACS · 475 publications · 43.8K citations
113
h-index
575 publications · 37.5K citations
97
h-index
PRB · 284 publications · 23.4K citations
79
h-index
400 publications · 22.4K citations
71
h-index
537 publications · 22.4K citations
70
h-index
1–5