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Yoshihisa Kagawa

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Publications

4

Citations

108

H-Index

4

Active since

2009

Affiliations

Sony (Taiwan)(Current)

Yoshihisa Kagawa is an author at Sony (Taiwan) specializing in electrical engineering, engineering, and materials science.

Top concepts

Publications per year

2009–2024

4

Publications

4

Development of face-to-face and face-to-back ultra-fine pitch Cu-Cu hybrid bonding

Yoshihisa Kagawa, Takumi Kamibayashi, YURIKO YAMANO et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 65 citations

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Characteristic measurement of spark transients due to finger touch

Yoshihisa Kagawa, Yoshinori Taka, Osamu Fujiwara · Journal of Electrostatics · 2009 · 17 citations

, , +7

Study of Ultra-Fine 0.4 μm Pitch Wafer-to-Wafer Hybrid Bonding and Impact of Bonding Misalignment

Yukako Ikegami, Takumi Onodera, Masanori Chiyozono et al. · 2024 · 16 citations

Cu-Cu Wiring: The Novel Structure of Cu-Cu Hybrid Bonding

Yoshihisa Kagawa, Takumi Kamibayashi, Nobutoshi Fujii et al. · 2023 · 10 citations

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