Kan Shimizu

4032 ppi High‐resolution OLED microdisplay

Takuma Fujii, Chiaki Kon, Yosuke Motoyama et al. · Journal of the Society for Information Display · 2018 · 89 citations

Engineering, Electrical Engineering, Microfabrication +13

Development of face-to-face and face-to-back ultra-fine pitch Cu-Cu hybrid bonding

Yoshihisa Kagawa, Takumi Kamibayashi, YURIKO YAMANO et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 66 citations

Engineering, Manufacturing Engineering, Materials Science +14

Study of Ultra-Fine 0.4 μm Pitch Wafer-to-Wafer Hybrid Bonding and Impact of Bonding Misalignment

Yukako Ikegami, Takumi Onodera, Masanori Chiyozono et al. · 2024 · 18 citations

Engineering, Materials Engineering, Materials Science +14

High-Density and Large-Scale MEA System Featuring 236,880 Electrodes at 11.72μm Pitch for Neuronal Network Analysis

Yuri Kato, Yoshihisa Matoba, Katsumi Honda et al. · 2020 · 15 citations

Engineering, Bioengineering, Neuroscience +17

46‐3: <i>Distinguished Paper:</i> 4032ppi High‐Resolution OLED Microdisplay

Takuma Fujii, Chiaki Kon, Yosuke Motoyama et al. · SID Symposium Digest of Technical Papers · 2018 · 13 citations

Engineering, Visualization, Microfabrication +9