Takumi Kamibayashi

Development of face-to-face and face-to-back ultra-fine pitch Cu-Cu hybrid bonding

Yoshihisa Kagawa, Takumi Kamibayashi, YURIKO YAMANO et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 66 citations

Engineering, Manufacturing Engineering, Materials Science +14

Impacts of Misalignment on 1μm Pitch Cu-Cu Hybrid Bonding

Y. Kagawa, H. Hashiguchi, Takumi Kamibayashi et al. · 2020 · 29 citations

Natural Sciences, Electrical Engineering, Materials Science +13

Liquid/solution-based microfluidic quantum dots light-emitting diodes for high-colour-purity light emission

Masahiro Kawamura, Hiroyuki Kuwae, Takumi Kamibayashi et al. · Scientific Reports · 2020 · 16 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Compensation of Surface Roughness Using an Au Intermediate Layer in a Cu Direct Bonding Process

Hirokazu Noma, Takumi Kamibayashi, Hiroyuki Kuwae et al. · Journal of Electronic Materials · 2018 · 13 citations

Engineering, Materials Engineering, Materials Science +13

Cu-Cu Wiring: The Novel Structure of Cu-Cu Hybrid Bonding

Yoshihisa Kagawa, Takumi Kamibayashi, Nobutoshi Fujii et al. · 2023 · 11 citations

Engineering, Electrical Engineering, Materials Engineering +12