Concepedia
Journal of Electronic Materials · 2018 · 13 citations · 21 references
EngineeringMaterials EngineeringMaterials ScienceMetallic MaterialsSurface EngineeringSurface ScienceCoatingsSurface CoatingsSurface MetrologySurface ModificationSurface RoughnessSurface Roughness EffectsDirect Wafer BondingMetal Surface BondingSurface BondingSurface Roughening
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On the temperature stability of gold nanorods: comparison between thermal and ultrafast laser-induced heating
Hristina Petrova, Jorge Pérez Juste, Isabel Pastoriza‐Santos et al. · Physical Chemistry Chemical Physics · 2005 · 314 citations
Natural Sciences, Materials Science, Physics +17
High-Density Through Silicon Vias for 3-D LSIs
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka · Proceedings of the IEEE · 2009 · 296 citations
Engineering, Electrical Engineering, Materials Science +17
A 1.2 V 12.8 GB/s 2 Gb Mobile Wide-I/O DRAM With 4 $\times$ 128 I/Os Using TSV Based Stacking
Jung‐Sik Kim, Chi Sung Oh, Hocheol Lee et al. · IEEE Journal of Solid-State Circuits · 2011 · 203 citations
Engineering, Computer Engineering, Electrical Engineering +16
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
Katsuyuki Sakuma, Paul Andry, Cornelia Tsang et al. · IBM Journal of Research and Development · 2008 · 163 citations
Engineering, Manufacturing Engineering, Manufacturing Processes +16
Diffusion in Copper and Copper Alloys, Part II. Copper-Silver and Copper-Gold Systems
Daniel B. Butrymowicz, J. R. Manning, Michael Read · Journal of Physical and Chemical Reference Data · 1974 · 124 citations
Natural Sciences, Materials Engineering, Materials Science +17