High-density packaging technologies on silicon substrates - Concepedia

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High-density packaging technologies on silicon substrates

16

Citations

0

References

2004

Year

Miyuki Akazawa, Satoru Kuramochi, Tomoko Tomoko, MARUYAMA MARUYAMA, Kouichi Nakayama, Akihito Takano, Miho Yamaguchi, Yoshitaka Fukuoka

Unknown Venue

Materials ScienceChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)MicrofabricationApplied PhysicsChip AttachmentElectronic PackagingMicroelectronicsHigh-density Packaging Technologies3D Printing

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