Japanese Journal of Applied Physics · 1998 · 90 citations · 1 references
EngineeringMaterials ScienceMicroelectromechanical SystemsMicrofabricationSemiconductor DevicesAdhesive BondingChip PackagingInterconnect TechnologyWafer BondingBonding AlignmentBonding TechniquesDie-to-wafer BondingPolishingShared MemoryShared Memory SystemsWafer-to-wafer Bonding
A new three-dimensional (3D) wafer bonding technology using the adhesive injection method has been proposed, in order to realize a real-time micro-vision system and a real shared memory. Several key technologies for 3D LSI, such as deep trench formation for buried interconnection, wafer grinding and chemical-mechanical polishing, wafer alignment and wafer bonding using the adhesive injection method, have been developed.
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Design and implementation of a 3D-LSI image sensing processor
K. Kioi, T. Shinozaki, S. Toyoyama et al. · IEEE Journal of Solid-State Circuits · 1992 · 18 citations