H. Itani

Future system-on-silicon LSI chips

Mitsumasa Koyanagi, H. Kurino, Kang Wook Lee et al. · IEEE Micro · 1998 · 336 citations

Engineering, Computer Engineering, Electrical Engineering +17

New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method

Takuji Matsumoto, Masakazu Satoh Masakazu Satoh, Katsuyuki Sakuma et al. · Japanese Journal of Applied Physics · 1998 · 90 citations

Engineering, Materials Science, Microelectromechanical Systems +13

Three-Diensional Integration Technology Based on Wafer Bonding Technique Using Micro-Bumps

Tsubasa Matsumoto, Y. Kudoh, M. Tahara et al. · 1995 · 49 citations

Engineering, Electrical Engineering, Microelectronics +13

Three-dimensional integration technology for real time micro-vision system

H. Kurino, Takuji Matsumoto, Kee-Ho Yu et al. · 2002 · 24 citations · Full text

Engineering, Manufacturing Engineering, Machine Vision +16

Wear mechanism of coated cemented carbide tool in cutting of inconel 718 super-heat-resisting alloy

Katsutoshi Itakura, Motofumi Kuroda, Hidefumi Omokawa et al. · International journal of the Japan Society for Precision Engineering · 1999 · 21 citations

Engineering, Manufacturing Engineering, Materials Science +16