Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications - Concepedia

Concepedia

Publication | Closed Access

Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications

17

Citations

17

References

2018

Year

Kaya Demir, Vijay Sukumaran, Yoichiro Sato, Abderrahim El Amrani, Koushik Ramachandran, Raghuram V. Pucha, P. Markondeya Raj, Venkatesh Sundaram, Rao Tummala

Journal of Materials Science Materials in Electronics

Fine-pitch Through-vias3D Ic ArchitectureHigh-bandwidth ComputingEngineeringChip-scale PackageAdvanced Packaging (Semiconductors)MicrofabricationGlass InterposersChip On BoardComputer EngineeringComputational ElectromagneticsElectronic PackagingMicroelectronicsOptoelectronics3D Printing

References

	Year	Citations

Page 1

Page 1