P. Markondeya Raj

Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias

Atom O. Watanabe, Tong‐Hong Lin, Muhammad Ali et al. · IEEE Transactions on Microwave Theory and Techniques · 2020 · 84 citations

Advanced Packaging, Through-glass Vias, Electrical Engineering +13

Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications

H. Windlass, P. Markondeya Raj, D. Balaraman et al. · IEEE Transactions on Advanced Packaging · 2003 · 74 citations

Materials Science, Materials Engineering, Dielectric Constant +13

First Demonstration of Compact, Ultra-Thin Low-Pass and Bandpass Filters for 5G Small-Cell Applications

Muhammad Ali, Fuhan Liu, Atom O. Watanabe et al. · IEEE Microwave and Wireless Components Letters · 2018 · 74 citations

Electrical Engineering, Millimeter Wave Technology, Engineering +15

Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications

Tong‐Hong Lin, Kimiyuki Kanno, Atom O. Watanabe et al. · IEEE Antennas and Wireless Propagation Letters · 2020 · 61 citations

Wireless Communications, Engineering, Radio Engineering +14

Trend from ICs to 3D ICs to 3D systems

Rao Tummala, Venky Sundaram, Ritwik Chatterjee et al. · 2009 · 57 citations

Engineering, Computer Architecture, 3D Modeling +18