Concepedia

Author

P. Markondeya Raj

Georgia Institute of TechnologyORCID

Also Known As

M Pulugurtha, M. R. Pulugurtha, M. Raj Pulugurtha, M.R. Pulugurtha, Markondeya Pulugurtha, Markondeya R. Pulugurtha, Markondeya Raj Pulugurtha, P M Raj, P Markondeya Raj, P. M Raj

234

Publications

2.2K

Citations

23

H-Index

113

Concepts

All Affiliations

Georgia Institute of TechnologyFlorida International UniversityKorea Advanced Institute of Science and TechnologyIntel (United States)
PM

About

P. Markondeya Raj is an author at Georgia Institute of Technology specializing in engineering, electrical engineering, and electronic packaging.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

22

65

1.5K

2

Applied Physics

15

23

510

3

Education

1

1

13

4

Medicine

1

1

11

5

Natural Sciences

1

1

57

P. Markondeya Raj

×

75

Publications

1.6K

Citations

22

H-Index

YearCitations

Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias

Atom O. Watanabe, Tong‐Hong Lin, Muhammad Ali,

IEEE Transactions on Microwave Theory and Techniques

2020

84

Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications

H. Windlass, P. Markondeya Raj, D. Balaraman,

IEEE Transactions on Advanced Packaging

2003

74

First Demonstration of Compact, Ultra-Thin Low-Pass and Bandpass Filters for 5G Small-Cell Applications

Muhammad Ali, Fuhan Liu, Atom O. Watanabe,

IEEE Microwave and Wireless Components Letters

2018

74

Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications

Tong‐Hong Lin, Kimiyuki Kanno, Atom O. Watanabe,

IEEE Antennas and Wireless Propagation Letters

2020

61

Trend from ICs to 3D ICs to 3D systems

Rao Tummala, Venky Sundaram, Ritwik Chatterjee,

2009

57

Antenna miniaturization using magneto-dielectric substrates

Nevin Altunyurt, Madhavan Swaminathan, P. Markondeya Raj,

2009

41

Reliability of Copper Through-Package Vias in Bare Glass Interposers

Kaya Demir, Andaç Armutlulu, Venky Sundaram,

IEEE Transactions on Components Packaging and Manufacturing Technology

2017

39

Ultralow-Loss Substrate-Integrated Waveguides in Glass-Based Substrates for Millimeter-Wave Applications

Atom O. Watanabe, Bijan Tehrani, Tomonori Ogawa,

IEEE Transactions on Components Packaging and Manufacturing Technology

2020

38

Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data Communications

Atom O. Watanabe, Muhammad Ali, Rui Zhang,

2020

36

Miniaturized High-Performance Filters for 5G Small-Cell Applications

Muhammad Ali, Fuhan Liu, Atom O. Watanabe,

2018

34

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