Jonghyun Cho

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Joohee Kim, Jun So Pak, Jonghyun Cho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 479 citations

Engineering, Vlsi Design, Scalable Model +17

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Jonghyun Cho, Eakhwan Song, Ki-Hyun Yoon et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 164 citations

Engineering, Through-silicon Via, Interconnect (Integrated Circuits) +16

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

Jun So Pak, Joohee Kim, Jonghyun Cho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 128 citations

Engineering, Chip-pdn Models, Power Electronics +16

Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC

Chang Liu, Taigon Song, Jonghyun Cho et al. · 2011 · 92 citations

3D Ic Architecture, Electrical Engineering, Physical Design (Electronics) +10

Suppression of leakage magnetic field from a wireless power transfer system using ferrimagnetic material and metallic shielding

Hongseok Kim, Jonghyun Cho, Seungyoung Ahn et al. · 2012 · 73 citations

Magnetism, Electrical Engineering, Wireless Power Transmission +11