Eakhwan Song

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Joohee Kim, Jun So Pak, Jonghyun Cho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 479 citations

Engineering, Vlsi Design, Scalable Model +17

Application of Time-Frequency Domain Reflectometry for Detection and Localization of a Fault on a Coaxial Cable

Yong–June Shin, E.J. Powers, Tok Son Choe et al. · IEEE Transactions on Instrumentation and Measurement · 2005 · 238 citations

Engineering, Measurement, Education +16

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Jonghyun Cho, Eakhwan Song, Ki-Hyun Yoon et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 164 citations

Engineering, Through-silicon Via, Interconnect (Integrated Circuits) +16

The global albedo of the Moon at 1064 nm from LOLA

P. G. Lucey, G. A. Neumann, M. A. Riner et al. · Journal of Geophysical Research Planets · 2014 · 125 citations · Full text

Earth-moon System, Engineering, Calibration +11

A Magnetic-Field Resonant Probe With Enhanced Sensitivity for RF Interference Applications

Hao-Hsiang Chuang, Guanghua Li, Eakhwan Song et al. · IEEE Transactions on Electromagnetic Compatibility · 2013 · 85 citations

Engineering, Radio Frequency, Magnetic-field Probe +20