Taigon Song

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Joohee Kim, Jun So Pak, Jonghyun Cho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 479 citations

Engineering, Vlsi Design, Scalable Model +17

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Jonghyun Cho, Eakhwan Song, Ki-Hyun Yoon et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 164 citations

Engineering, Through-silicon Via, Interconnect (Integrated Circuits) +16

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

Jun So Pak, Joohee Kim, Jonghyun Cho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 128 citations

Engineering, Chip-pdn Models, Power Electronics +16

3D-MAPS: 3D Massively parallel processor with stacked memory

Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy et al. · 2012 · 117 citations

Engineering, Computer Architecture, Computer-aided Design +23

Low frequency electromagnetic field reduction techniques for the On-Line Electric Vehicle (OLEV)

Seungyoung Ahn, Junso Pak, Taigon Song et al. · 2010 · 112 citations

Electrical Engineering, Wireless Power Transmission, Engineering +11