Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles - Concepedia

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Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles

107

Citations

22

References

2001

Year

Fei Guo, Jessica Lee, S. Choi, J. P. Lucas, Thomas R. Bieler, K. N. Subramanian

Journal of Electronic Materials

Materials EngineeringMaterials ScienceEngineeringPowder MetallurgySuperalloyNi ParticlesMechanical EngineeringMetallurgical ProcessMetal ProcessingMicrostructureEutectic Sn-3.5ag Solder

References

	Year	Citations

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