Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles

Smithells metals reference book

Choice Reviews Online · 1993 · 839 citations

Natural Sciences, Materials Science, Metallic Materials +3

Metallurgy of low temperature Pb-free solders for electronic assembly

J. Glazer · International Materials Reviews · 1995 · 416 citations

Natural Sciences, Materials Engineering, Materials Science +13

Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

S. Choi, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 1999 · 215 citations

Natural Sciences, Materials Engineering, Materials Science +17

Fundamentals of nanoindentation and nanotribology

N. R. Moody, W. W. Gerberich, N. A. Burnham et al. · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 1998 · 188 citations

Natural Sciences, Materials Engineering, Materials Science +17

The growth of Cu-Sn intermetallics at a pretinned copper-solder interface

A.J. Sunwoo, J. W. Morris, George K. Lucey · Metallurgical Transactions A · 1992 · 176 citations

Natural Sciences, Materials Engineering, Materials Science +12