Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder

Metallurgy of low temperature Pb-free solders for electronic assembly

J. Glazer · International Materials Reviews · 1995 · 416 citations

Natural Sciences, Materials Engineering, Materials Science +13

Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate

Won Kyoung Choi, Hyuck Mo Lee · Journal of Electronic Materials · 2000 · 192 citations

Natural Sciences, Materials Engineering, Materials Science +17

Microstructure evolution in Sn–Bi and Sn–Bi–Cu solder joints under thermal aging

Hui-Wei Miao, Jenq‐Gong Duh · Materials Chemistry and Physics · 2001 · 157 citations

Natural Sciences, Materials Engineering, Materials Science +13

Properties of ternary Sn-Ag-Bi solder alloys: Part II—Wettability and mechanical properties analyses

Paul T. Vianco, Jerome A. Rejent · Journal of Electronic Materials · 1999 · 111 citations

Natural Sciences, Materials Engineering, Materials Science +14

Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy

Yoshiharu Kariya, Masahisa Otsuka · Journal of Electronic Materials · 1998 · 96 citations

Natural Sciences, Materials Engineering, Materials Science +11