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Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate
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Citations
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References
2000
Year
Materials ScienceMaterials EngineeringSn-3.5ag Solder AlloyIntermetallic CompoundsPowder MetallurgyEngineeringCorrosionMechanical EngineeringMetallurgical ProcessInterfacial MicrostructureMicrostructureMetal Processing
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