Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

Engineering, Materials Engineering, Materials Science +14

Theory and simulation of Ostwald ripening

Jian Yao, K. R. Elder, Guo Hong et al. · Physical review. B, Condensed matter · 1993 · 343 citations · Full text

Engineering, Materials Science, Computational Fluid Dynamics +15

Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control

Matt Schaefer, R.A. Fournelle, Jin Liang · Journal of Electronic Materials · 1998 · 327 citations

Natural Sciences, Materials Engineering, Materials Science +14

Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation

Byeong‐Joo Lee, Nong‐Moon Hwang, Hyuck Mo Lee · Acta Materialia · 1997 · 268 citations

Natural Sciences, Materials Engineering, Materials Science +16

Reaction-Diffusion in the Cu–Sn System

Masami Onishi, Hideo Fujibuchi · Transactions of the Japan Institute of Metals · 1975 · 235 citations · Full text

Natural Sciences, Materials Science, Physics +14