Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder

Properties of lead-free solder alloys with rare earth element additions

Chi‐Man Lawrence Wu, Daquan Yu, C. Law et al. · Materials Science and Engineering R Reports · 2004 · 587 citations

Natural Sciences, Materials Engineering, Materials Science +10

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

Engineering, Materials Engineering, Materials Science +14

Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys

Young‐Sun Kim, Keun‐Soo Kim, Chi-Won Hwang et al. · Journal of Alloys and Compounds · 2003 · 227 citations

Natural Sciences, Materials Engineering, Materials Science +10

Wetting and interface microstructure between Sn–Zn binary alloys and Cu

Katsuaki Suganuma, Koichi Niihara, Takeshi Shoutoku et al. · Journal of materials research/Pratt's guide to venture capital sources · 1998 · 216 citations

Natural Sciences, Materials Engineering, Materials Science +14

Improved mechanical properties in new, Pb-free solder alloys

M. McCormack, S. Jin · Journal of Electronic Materials · 1994 · 168 citations

Natural Sciences, Materials Engineering, Materials Science +12