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Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder

Materials EngineeringMaterials ScienceSn–pb SolderInterfacial ReactionsEngineeringCorrosionSn–ag–cu Lead-free SolderAlloy PhaseMicrostructureMetal Processing