Concepedia

D.Y Luk

DL

2

Publications

230

Citations

2

H-Index

2002

Active since

Affiliations

City University of Hong Kong(Current)

D.Y Luk is an author at City University of Hong Kong specializing in mechanical engineering, microelectronics, and materials science.

Top concepts

EngineeringMaterial ScienceMicroelectronicsElectronic PackagingMechanical EngineeringMechanics Of Materials

Publications per year

2002–2002

2

Publications

2

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature

Y.C. Chan, D.Y Luk · Microelectronics Reliability · 2002 · 117 citations

Materials Science, Different Bonding Temperature, Flip-chip-on-flex Packages +10

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure

Y.C. Chan, D.Y Luk · Microelectronics Reliability · 2002 · 113 citations

Materials Science, Flip-chip-on-flex Packages, Chip-scale Package +11

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