Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO2 composite solder on OSP-Cu pads

Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

L.C. Tsao, Shih‐Ying Chang · Materials & Design (1980-2015) · 2009 · 181 citations

Natural Sciences, Materials Engineering, Materials Science +16

Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints

Jeong‐Won Yoon, Bo‐In Noh, Bong-Kyun Kim et al. · Journal of Alloys and Compounds · 2009 · 140 citations

Natural Sciences, Materials Engineering, Materials Science +13

Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering

L.C. Tsao · Journal of Alloys and Compounds · 2010 · 102 citations

Natural Sciences, Materials Engineering, Materials Science +16

The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering

C. C. Chang, Yan‐Cheng Lin, Yi-Wun Wang et al. · Journal of Alloys and Compounds · 2009 · 101 citations

Engineering, Materials Engineering, Materials Science +8

Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint

Bo Li, Yongping Lei, Fu Guo et al. · Journal of Electronic Materials · 2005 · 89 citations

Natural Sciences, Materials Engineering, Materials Science +10