L.C. Tsao - Concepedia

Author

L.C. Tsao

National Pingtung University of Science and Technology ORCID

Also Known As

L C Tsao, L. C. Tsao, L.-C. Tsao, L.C Tsao, L.C. TSAO, L.C. Tsao, Ling-Chuan Tsao, Lung-Chuan Tsao

Publications

2.8K

Citations

H-Index

Concepts

All Affiliations

National Pingtung University of Science and Technology National Taiwan University National Yunlin University of Science and Technology National Cheng Kung University National Formosa University

About

L.C. Tsao is an author at National Pingtung University of Science and Technology specializing in engineering, materials science, and materials engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	29	52	2.6K
2	Applied Physics	15	18	945
3	Chemistry	6	6	201
4	Chemical Engineering	3	3	277
5	Biomedical Engineering	1	1	21

L.C. Tsao

Publications

2.6K

Citations

H-Index

Page 1

	Year	Citations
Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder L.C. Tsao, Shih‐Ying Chang, Chih-Chen Lee, Materials & Design (1980-2015) Materials ScienceMaterials EngineeringEngineeringPowder MetallurgyCorrosion	2010	205
Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder L.C. Tsao, Shih‐Ying Chang Materials & Design (1980-2015) Materials ScienceMaterials EngineeringSn3.5ag0.25cu SolderEngineeringPowder Metallurgy	2009	181
An integrated flexible temperature and tactile sensing array using PI-copper films Yao‐Joe Yang, Ming‐Yuan Cheng, Wen‐Yi Chang, Sensors and Actuators A Physical Tactile SensingMaterials SciencePi-copper FilmsEngineeringFlexible Electronics	2007	163
Suppressing effect of 0.5wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging L.C. Tsao Journal of Alloys and Compounds Materials ScienceMaterials EngineeringChemical EngineeringCu SubstrateEngineering	2011	129
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder Shih‐Ying Chang, Chao‐Chi Jain, Tung‐Han Chuang, Materials & Design (1980-2015) Materials ScienceInterfacial ReactionsChemical EngineeringTio2 NanoparticlesEngineering	2011	123
Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder L.C. Tsao, Chia-Wei Huang, Chin-Sung Chung, Materials Science and Engineering A Materials ScienceEngineeringPowder MetallurgyMechanical PropertiesNanomaterials	2012	121
Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering L.C. Tsao Journal of Alloys and Compounds Materials EngineeringMaterials ScienceSn3.5ag0.5cu Composite Solder/cuEngineeringMetal Nanoparticles	2010	100
Age hardening reaction of the Al0.3CrFe1.5MnNi0.5 high entropy alloy L.C. Tsao, C.S. Chen, Chien-Hsun Chu Materials & Design (1980-2015) Materials ScienceMaterials EngineeringEngineeringCorrosionAlloy Phase	2011	95
Joining 6061 aluminum alloy with Al–Si–Cu filler metals Shih‐Ying Chang, L.C. Tsao, T.Y. Li, Journal of Alloys and Compounds Materials EngineeringMaterials ScienceEngineeringMetallurgical InteractionAluminum Alloy	2009	77
Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder Chin-Tzuan Chuang, L.C. Tsao, H.K. Lin, Materials Science and Engineering A Materials EngineeringMaterials ScienceEngineeringPowder MetallurgyApplied Physics	2012	76

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