Publication | Closed Access
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
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Citations
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References
2011
Year
Materials ScienceInterfacial ReactionsChemical EngineeringTio2 NanoparticlesEngineeringPowder MetallurgySn3.5agxcu SolderNanomaterialsMetallurgical ProcessPowder SynthesisMicrostructureMetal ProcessingMaterial Preparation
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