Concepedia

Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

Shih‐Ying Chang, Chao‐Chi Jain, Tung‐Han Chuang, Long Feng, L.C. Tsao

Materials & Design (1980-2015) · 2011 · 123 citations · 22 references

DOI

Concepts

References

22

Lead-free Solders in Microelectronics

Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports · 2000 · 2K citations

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Research advances in nano-composite solders

Jun Shen, Y.C. Chan · Microelectronics Reliability · 2008 · 230 citations

, , +12

Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

Iver E. Anderson · Journal of Materials Science Materials in Electronics · 2006 · 209 citations

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Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

L.C. Tsao, Shih‐Ying Chang, Chih-Chen Lee et al. · Materials & Design (1980-2015) · 2010 · 208 citations

, , +16

Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

L.C. Tsao, Shih‐Ying Chang · Materials & Design (1980-2015) · 2009 · 181 citations

, , +16