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Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

DOI

205

Citations

15

References

2010

Year

L.C. Tsao, Shih‐Ying Chang, Chih-Chen Lee, Wenyu Sun, Cong‐Hui Huang
Materials & Design (1980-2015)

References

YearCitations

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