Publication | Closed Access
Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering
100
Citations
29
References
2010
Year
Materials EngineeringMaterials ScienceSn3.5ag0.5cu Composite Solder/cuEngineeringMetal NanoparticlesNanomaterialsNanotechnologyApplied PhysicsCu–sn Intermetallic CompoundsMetallic NanomaterialsChemistryNano-ag3sn Particle Formation
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