Concepedia

Kenny C. Otiaba

KC

9

Publications

456

Citations

9

H-Index

2011

Active since

Affiliations

University of Greenwich(Current)

Kenny C. Otiaba is an author at University of Greenwich specializing in electronic packaging, engineering, and thermal engineering.

Top concepts

Publications per year

2011–2013

9

Publications

9

Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges

Kenny C. Otiaba, N.N. Ekere, Raj Bhatti et al. · Microelectronics Reliability · 2011 · 142 citations

, , +11

Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach

Kenny C. Otiaba, Raj Bhatti, N.N. Ekere et al. · Engineering Failure Analysis · 2012 · 68 citations

, , +7

Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device

Kenny C. Otiaba, Raj Bhatti, N.N. Ekere et al. · Microelectronics Reliability · 2012 · 64 citations

, , +13

Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material

Kenny C. Otiaba, Michael Okereke, Raj Bhatti · Applied Thermal Engineering · 2013 · 61 citations

, , +14

Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics

Mathias Ekpu, Raj Bhatti, Michael Okereke et al. · Microelectronics Reliability · 2013 · 43 citations

, , +13

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