Mathias Ekpu

Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach

Kenny C. Otiaba, Raj Bhatti, N.N. Ekere et al. · Engineering Failure Analysis · 2012 · 69 citations

Natural Sciences, Materials Engineering, Materials Science +16

Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device

Kenny C. Otiaba, Raj Bhatti, N.N. Ekere et al. · Microelectronics Reliability · 2012 · 64 citations

Engineering, Computer Engineering, Electrical Engineering +17

Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics

Mathias Ekpu, Raj Bhatti, Michael Okereke et al. · Microelectronics Reliability · 2013 · 43 citations

Natural Sciences, Materials Engineering, Materials Science +16

Investigation of effects of heat sinks on thermal performance of microelectronic package

Mathias Ekpu, Raj Bhatti, Sabuj Mallik et al. · 2011 · 24 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Thermal Effect of Cylindrical Heat Sink on Heat Management in LED Applications

Mathias Ekpu, Eugene A. Ogbodo, Felix Ngobigha et al. · Energies · 2022 · 13 citations · Full text

Engineering, Materials Engineering, Mechanical Engineering +17