Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys

Pb-free solders for flip-chip interconnects

D. R. Frear, Jihun Jang, J. K. Lin et al. · JOM · 2001 · 317 citations

Engineering, Electrical Engineering, Materials Engineering +14

Improved mechanical properties in new, Pb-free solder alloys

M. McCormack, S. Jin · Journal of Electronic Materials · 1994 · 168 citations

Natural Sciences, Materials Engineering, Materials Science +12

Significantly Improved Mechanical Properties of Bi- Sn Solder Alloys by Ag- Doping

M. McCormack, H. S. Chen, G. W. Kammlott et al. · Journal of Electronic Materials · 1997 · 128 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder

Seok‐Hwan Huh, Keun‐Soo Kim, Katsuaki Suganuma · MATERIALS TRANSACTIONS · 2001 · 88 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Creep behavior of eutectic Sn-Cu lead-free solder alloy

Chi‐Man Lawrence Wu, Mingliang Huang · Journal of Electronic Materials · 2002 · 75 citations

Natural Sciences, Materials Engineering, Materials Science +14