Inkjet printed System-in-Package design and manufacturing

J. Miettinen, Ville Pekkanen, Kimmo Kaija, +7

Microelectronics Journal

Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package

Ville Pekkanen, Matti Mäntysalo, Kimmo Kaija, +7

Microelectronic Engineering

Industrial DesignElectrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors) +5

Capability of inkjet technology in electronics manufacturing

Matti Mäntysalo, Ville Pekkanen, Kimmo Kaija, +5

Industrial DesignElectrical EngineeringInkjet TechnologyEngineeringIndustrial Engineering +11

Reliability of ICA attachment of SMDs on inkjet-printed substrates

Juha Niittynen, Janne Kiilunen, Jussi Putaala, +4

Microelectronics Reliability

Ica AttachmentEngineeringAdvanced Packaging (Semiconductors)Flexible ElectronicsMicrofabrication +5

Inkjetting dielectric layer for electronic applications

Kimmo Kaija, Ville Pekkanen, Matti Mäntysalo, +4

Microelectronic Engineering

Materials ScienceConducting PolymerElectrical EngineeringDielectricsDielectric Layer +6

Controlling warpage of molded package for inkjet manufacturing

Kimmo Kaija, Ville Pekkanen, Matti Mäntysalo, +1

Microelectronic Engineering

Materials ScienceEngineeringMicrofabricationMolded PackageMechanical Engineering +4

Functional fluid jetting performance optimization

Ville Pekkanen, Kimmo Kaija, Matti Mäntysalo, +3

Microelectronics Reliability

EngineeringFluid MechanicsFunctional FluidAerospace PropulsionMultiphase Flow