Concepedia
Statistics
Publications
11
Citations
211
H-Index
Active since
2005
Affiliations
University of Oulu(Current)
Nokia (Finland)
Oulu University of Applied Sciences
Tampere University of Applied Sciences
Jussi Putaala is an author at University of Oulu specializing in engineering, electronic packaging, and electrical engineering.
Top concepts
EngineeringElectronic PackagingElectrical EngineeringMaterial ScienceMechanical EngineeringHeat TransferMicroelectronicsThermal EngineeringElectromagnetic CompatibilityMicrofabrication
Publications per year
2005–2021
Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies
T. Kangasvieri, Olli Nousiainen, Jussi Putaala et al. · Microelectronics Reliability · 2005 · 38 citations
Electrical Engineering, Engineering, Bga Solder Joints +6
Reliability of ICA attachment of SMDs on inkjet-printed substrates
Juha Niittynen, Janne Kiilunen, Jussi Putaala et al. · Microelectronics Reliability · 2012 · 34 citations
Ica Attachment, Engineering, Advanced Packaging (Semiconductors) +7
Detection of Thermal Cycling-Induced Failures in RF/Microwave BGA Assemblies
Jussi Putaala, T. Kangasvieri, Olli Nousiainen et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2008 · 24 citations
Electrical Engineering, Reliability Engineering, Engineering +15
Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors
Jussi Putaala, Jari Hannu, Esa Kunnari et al. · Microelectronics Reliability · 2013 · 20 citations
Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +13
Metallurgical reactions in composite 90Pb10Sn/lead-free solder joints and their effect on reliability of LTCC/PWB assembly
Olli Nousiainen, Jussi Putaala, T. Kangasvieri et al. · Journal of Electronic Materials · 2006 · 18 citations
Materials Science, Materials Engineering, Engineering +9
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