Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies

The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure

A. Zribi, A. Clark, L. Zavalij et al. · Journal of Electronic Materials · 2001 · 122 citations

Materials Science, Materials Engineering, Solder Microstructure +9

Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization

Sang-Won Kim, Jeong‐Won Yoon, Seung‐Boo Jung · Journal of Electronic Materials · 2004 · 82 citations

Materials Science, Materials Engineering, Interfacial Reactions +11

Inhibiting the formation of (Au1−xNix)Sn4 and reducing the consumption of Ni metallization in solder joints

Cheng–En Ho, Li-Chan Shiau, C. R. Kao · Journal of Electronic Materials · 2002 · 67 citations

Materials Science, Materials Engineering, Engineering +10

Novel LTCC/BGA modules for highly integrated millimeter-wave transceivers

Johann Heyen, T. v. Kerssenbrock, A. L. Chernyakov et al. · IEEE Transactions on Microwave Theory and Techniques · 2003 · 64 citations

Engineering, Bga Technology, Integrated Circuits +17

Intermetallic compound growth on Ni, Au/Ni, and Pd/Ni substrates with Sn/Pb, Sn/Ag, and Sn solders [PWBs]

H.D. Blair, Tsung‐Yu Pan, J.M. Nicholson · 2002 · 46 citations

Materials Engineering, Materials Science, Chemical Engineering +14