Concepedia

T. Kangasvieri

TK

16

Publications

382

Citations

12

H-Index

2003

Active since

Affiliations

University of Oulu(Current)

VTT Technical Research Centre of Finland

Oulu University of Applied Sciences

Nokia (Finland)

T. Kangasvieri is an author at University of Oulu specializing in electronic packaging, engineering, and electrical engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringElectromagnetic CompatibilityAntennaMicrowave EngineeringMicroelectronicsMaterial ScienceMechanical EngineeringComputational Electromagnetics

Publications per year

2003–2020

16

Publications

16

Design aspects of microwave components with LTCC technique

Heli Jantunen, T. Kangasvieri, Jouko Vähäkangas et al. · Journal of the European Ceramic Society · 2003 · 128 citations

Electrical Engineering, Engineering, Antenna +5

Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies

T. Kangasvieri, Olli Nousiainen, Jussi Putaala et al. · Microelectronics Reliability · 2005 · 38 citations

Electrical Engineering, Engineering, Bga Solder Joints +6

Broadband BGA-Via Transitions for Reliable RF/Microwave LTCC-SiP Module Packaging

T. Kangasvieri, Jukka Halme, Jouko Vähäkangas et al. · IEEE Microwave and Wireless Components Letters · 2008 · 28 citations

Electrical Engineering, Chip-scale Package, Engineering +13

Detection of Thermal Cycling-Induced Failures in RF/Microwave BGA Assemblies

Jussi Putaala, T. Kangasvieri, Olli Nousiainen et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2008 · 24 citations

Electrical Engineering, Reliability Engineering, Engineering +15

Metallurgical reactions in composite 90Pb10Sn/lead-free solder joints and their effect on reliability of LTCC/PWB assembly

Olli Nousiainen, Jussi Putaala, T. Kangasvieri et al. · Journal of Electronic Materials · 2006 · 18 citations

Materials Science, Materials Engineering, Engineering +9

Rows per page

1–5 of 16