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Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Flexible ElectronicsMicrofabricationMechanical EngineeringApplied PhysicsSmd InterconnectionsPrinted ElectronicsFlexible Low-temperature SubstratesChip AttachmentInkjet-printed ConductorsElectronic PackagingDevice ReliabilityMicroelectronicsElectrical Insulation