Reliability of ICA attachment of SMDs on inkjet-printed substrates

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Printable electronics: flexibility for the future

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Inkjet printed System-in-Package design and manufacturing

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Reliability evaluation of adhesive bonded SMT components in industrial applications

Marie-Geneviève Périchaud, Jean-Yves Delétage, H. Frémont et al. · Microelectronics Reliability · 2000 · 55 citations

Engineering, Materials Engineering, Materials Science +14