Concepedia
Statistics
Publications
23
Citations
558
H-Index
14
Active since
2000
Affiliations
Université de Bordeaux(Current)
Institut Polytechnique de Bordeaux
Laboratoire de l'Intégration du Matériau au Système
Commissariat à l'Énergie Atomique et aux Énergies Alternatives
STMicroelectronics (France)
H. Frémont is an author at Université de Bordeaux specializing in engineering, electronic packaging, and mechanical engineering.
Top concepts
EngineeringElectronic PackagingMaterial ScienceMechanical EngineeringMechanics Of MaterialsMicroelectronicsElectrical EngineeringApplied PhysicsMaterials EngineeringMicrostructure
Publications per year
2000–2023
Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness
J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 81 citations
Engineering, Device Integration, Integrated Circuits +24
Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage
Maxime Berthou, P. Retailleau, H. Frémont et al. · Microelectronics Reliability · 2009 · 60 citations
Materials Science, Materials Engineering, Engineering +12
Reliability evaluation of adhesive bonded SMT components in industrial applications
Marie-Geneviève Périchaud, Jean-Yves Delétage, H. Frémont et al. · Microelectronics Reliability · 2000 · 55 citations
Reliability, Reliability Engineering, Engineering +9
Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements
S. Moreau, J. Jourdon, S. Lhostis et al. · ECS Journal of Solid State Science and Technology · 2022 · 46 citations
Engineering, Reliability Achievements, Interconnect (Integrated Circuits) +16
Evaluation of Hybrid Bonding Interface Quality by Contact Resistivity Measurement
J. Jourdon, S. Lhostis, S. Moreau et al. · IEEE Transactions on Electron Devices · 2019 · 32 citations
Engineering, Integrated Circuits, Contact Resistance +19
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