Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage

Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength

J.H.L. Pang, T.H. Low, B.S. Xiong et al. · Thin Solid Films · 2004 · 198 citations

Materials Engineering, Materials Science, Engineering +5

Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints

J.H.L. Pang, Luhua Xu, Xu Shi et al. · Journal of Electronic Materials · 2004 · 115 citations

Materials Engineering, Materials Science, Engineering +6

Quantitative metallography of β-Sn dendrites in Sn-3.8Ag-0.7Cu ball grid array solder balls via electron backscatter diffraction and polarized light microscopy

Aaron D. LaLonde, D. Emelander, J. Jeannette et al. · Journal of Electronic Materials · 2004 · 66 citations

Materials Science, Engineering, Nanomaterials +5

Investigation of IMC Thickness Effect on the Lead-free Solder Ball Attachment Strength: Comparison between Ball Shear Test and Cold Bump Pull Test Results

Fang Song, S. W. Ricky Lee · 2006 · 57 citations

Materials Science, Engineering, Imc Thickness Effect +12

Intermetallics Characterization of Lead-Free Solder Joints under Isothermal Aging

Anupam Choubey, Hao Yu, Michael Osterman et al. · Journal of Electronic Materials · 2008 · 57 citations

Materials Engineering, Materials Science, Friction Welding +7