Concepedia

T.H. Low

TL

16

Publications

1K

Citations

14

H-Index

2001

Active since

Affiliations

Nanyang Technological University(Current)

T.H. Low is an author at Nanyang Technological University specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMaterial ScienceElectrical EngineeringMicrostructureMechanics Of MaterialsMicroelectronicsReliability EngineeringSolid Mechanics

Publications per year

2001–2005

16

Publications

16

Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength

J.H.L. Pang, T.H. Low, B.S. Xiong et al. · Thin Solid Films · 2004 · 198 citations

Materials Engineering, Materials Science, Engineering +5

Thermal cycling analysis of flip-chip solder joint reliability

J.H.L. Pang, Desmond Y. R. Chong, T.H. Low · IEEE Transactions on Components and Packaging Technologies · 2001 · 165 citations

Engineering, Mechanical Engineering, Reliability Concern +18

Low cycle fatigue models for lead-free solders

J.H.L. Pang, B.S. Xiong, T.H. Low · Thin Solid Films · 2004 · 120 citations

Electrical Engineering, Engineering, Hardware Reliability +8

Creep and fatigue characterization of lead free 95.5Sn-3.8Ag-0.7Cu solder

J.H.L. Pang, B.S. Xiong, T.H. Low · 2004 · 99 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface

Luhua Xu, J.H.L. Pang, K. H. Prakash et al. · IEEE Transactions on Components and Packaging Technologies · 2005 · 98 citations

Imc Growth, Engineering, Lead-based Solder Interface +17

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