Concepedia

Desmond Y. R. Chong

DY

Statistics

Publications

33

Citations

1.2K

H-Index

18

Active since

2001

Affiliations

Singapore Institute of Technology(Current)

Nanyang Technological University

National University of Singapore

National University Hospital

Sichuan University

Desmond Y. R. Chong is an author at Singapore Institute of Technology specializing in engineering, microelectronics, and electronic packaging.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMicroelectronicsElectrical EngineeringOrthopedicsMaterial ScienceMedicineBiomechanicsMechanics Of Materials

Publications per year

2001–2023

33

Publications

33

Thermal cycling analysis of flip-chip solder joint reliability

J.H.L. Pang, Desmond Y. R. Chong, T.H. Low · IEEE Transactions on Components and Packaging Technologies · 2001 · 165 citations

Engineering, Mechanical Engineering, Reliability Concern +18

Drop impact reliability testing for lead-free and lead-based soldered IC packages

Desmond Y. R. Chong, J.H.L. Pang, Kellin Ng et al. · Microelectronics Reliability · 2005 · 154 citations

Reliability, Electrical Engineering, Reliability Engineering +9

Analysis of bone–prosthesis interface micromotion for cementless tibial prosthesis fixation and the influence of loading conditions

Desmond Y. R. Chong, Ulrich Hansen, Andrew A. Amis · Journal of Biomechanics · 2010 · 95 citations

Engineering, Biomechanics, Bone Repair +4

Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models

J.H.L. Pang, Desmond Y. R. Chong · IEEE Transactions on Advanced Packaging · 2001 · 88 citations

Fea Models, Engineering, Different Fea Models +20

The influence of tibial component fixation techniques on resorption of supporting bone stock after total knee replacement

Desmond Y. R. Chong, Ulrich Hansen, R. van der Venne et al. · Journal of Biomechanics · 2011 · 71 citations

Total Knee Replacement, Biomechanics, Osteoarthritis +7

Rows per page

1–5 of 33