E. Ristolainen

Mechanical and microstructural properties of SnAgCu solder joints

Janne J. Sundelin, Sami T. Nurmi, T. Lepistö et al. · Materials Science and Engineering A · 2006 · 114 citations

Materials Science, Friction Welding, Engineering +8

System design issues for 3D system-in-package (SiP)

J. Miettinen, Matti Mäntysalo, Kimmo Kaija et al. · 2004 · 66 citations

Engineering, Computer Architecture, Software Engineering +27

Stacking-fault energy of copper from molecular-dynamics simulations

Pekka Heino, L. F. Perondi, Kimmo Kaski et al. · Physical review. B, Condensed matter · 1999 · 64 citations

Engineering, Material Simulation, Model Potentials +16

Thermal conduction at the nanoscale in some metals by MD

Pekka Heino, E. Ristolainen · Microelectronics Journal · 2003 · 52 citations

Effects of intermediate zinc pulses on properties of TiN and NbN films deposited by atomic layer epitaxy

Mikko Ritala, Timo Asikainen, Markku Leskelä et al. · Applied Surface Science · 1997 · 49 citations

Materials Science, Engineering, Physics +8