Janne J. Sundelin

Mechanical and microstructural properties of SnAgCu solder joints

Janne J. Sundelin, Sami T. Nurmi, T. Lepistö et al. · Materials Science and Engineering A · 2006 · 114 citations

Materials Science, Friction Welding, Engineering +8

Recrystallization behaviour of SnAgCu solder joints

Janne J. Sundelin, Sami T. Nurmi, T. Lepistö · Materials Science and Engineering A · 2007 · 96 citations

Materials Science, Materials Engineering, Engineering +7

The effect of solder paste composition on the reliability of SnAgCu joints

Sami T. Nurmi, Janne J. Sundelin, E. Ristolainen et al. · Microelectronics Reliability · 2003 · 49 citations

Snagcu Joints, Engineering, Mechanical Engineering +3

Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications

Minna Arra, Dongkai Shangguan, Dongji Xie et al. · Journal of Electronic Materials · 2004 · 48 citations

Materials Engineering, Materials Science, Electrical Engineering +12

Characterization of twin‐screw‐extruder‐compounded polycarbonate nanoclay composites

Katja Nevalainen, Jyrki Vuorinen, V. Villman et al. · Polymer Engineering and Science · 2008 · 36 citations · Full text

Materials Science, Abstract Polycarbonate Nanocomposites, Polymer Material +12