Minna Arra

Solder joint behavior of area array packages in board level drop for handheld devices

Dongji Xie, Minna Arra, Sanuny Yi et al. · 2004 · 61 citations

Advanced Packaging, Pcb Board, Chip-scale Package +15

Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications

Minna Arra, Dongkai Shangguan, Dongji Xie et al. · Journal of Electronic Materials · 2004 · 48 citations

Materials Engineering, Materials Science, Electrical Engineering +12

Development of lead-free wave soldering process

Minna Arra, Dongkai Shangguan, Sanuny Yi et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 39 citations

Materials Science, Materials Engineering, Chemical Engineering +13

Performance of lead-free solder joints under dynamic mechanical loading

Minna Arra, Dongji Xie, Dongkai Shangguan · 2003 · 26 citations

Friction Welding, Engineering, Mechanical Engineering +17

Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards

Minna Arra, Dongkai Shangguan, E. Ristolainen et al. · Soldering and Surface Mount Technology · 2002 · 22 citations

Engineering, Mechanical Engineering, Reflow Profile +21