Dongkai Shangguan

An analytical model for the interaction between an insoluble particle and an advancing solid/liquid interface

Dongkai Shangguan, Sanjay Ahuja, D. M. Stefanescu · Metallurgical Transactions A · 1992 · 368 citations

Natural Sciences, Materials Science, Physics +16

Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure

Srinivas Chada, R.A. Fournelle, W. Laub et al. · Journal of Electronic Materials · 2000 · 108 citations

Natural Sciences, Materials Engineering, Materials Science +11

Modeling of the liquid/solid and the eutectoid phase transformations in spheroidal graphite cast iron

Suli Chang, Dongkai Shangguan, D. M. Stefanescu · Metallurgical Transactions A · 1992 · 70 citations

Natural Sciences, Materials Engineering, Materials Science +14

Design for lead‐free solder joint reliability of high‐density packages

John H. Lau, Walter Dauksher, Joe Smetana et al. · Soldering and Surface Mount Technology · 2004 · 58 citations

Natural Sciences, Materials Engineering, Materials Science +15

An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates

Srinivas Chada, W. Laub, R.A. Fournelle et al. · Journal of Electronic Materials · 1999 · 57 citations

Natural Sciences, Materials Engineering, Materials Science +9