Walter Dauksher - Concepedia

Author

Walter Dauksher

Agilent Technologies (United States)

Also Known As

W. Dauksher, Walter Dauksher

Publications

500

Citations

H-Index

Concepts

All Affiliations

Agilent Technologies (United States)Broadcom (United States)Endicott College Flex (United States)University of Washington

About

Walter Dauksher is an author at Agilent Technologies (United States) specializing in engineering, electronic packaging, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	13	420
2	Electrical Engineering	7	7	185
3	Materials Engineering	2	2	26
4	Natural Sciences	1	1	30
5	Industrial Engineering	1	1	39

Walter Dauksher

Publications

430

Citations

H-Index

Page 1

	Year	Citations
Accuracy in modeling the acoustic wave equation with Chebyshev spectral finite elements Walter Dauksher, A. F. Emery Finite Elements in Analysis and Design Numerical AnalysisAeroacousticsAcoustic Wave EquationEngineeringPhysics	1997	78
The solution of elastostatic and elastodynamic problems with Chebyshev spectral finite elements Walter Dauksher, A. F. Emery Computer Methods in Applied Mechanics and Engineering Spectral TheoryFinite Element MethodNumerical AnalysisMethod Of Fundamental SolutionEngineering	2000	62
Design for lead‐free solder joint reliability of high‐density packages John H. Lau, Walter Dauksher, Joe Smetana, Soldering and Surface Mount Technology Materials ScienceAdvanced PackagingElectrical EngineeringReliability EngineeringEngineering	2004	58
A Second-Level SAC Solder-Joint Fatigue-Life Prediction Methodology Walter Dauksher IEEE Transactions on Device and Materials Reliability Reliability EngineeringEngineeringDurability PerformanceService Life PredictionIndustrial Engineering	2008	39
An evaluation of the cost effectiveness of Chebyshev spectral andp-finite element solutions to the scalar wave equation Walter Dauksher, A. F. Emery International Journal for Numerical Methods in Engineering Spectral TheoryNumerical AnalysisEngineeringFinite ElementsComputational Mechanics	1999	30
Effects of Ramp-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints John H. Lau, Walter Dauksher Materials ScienceElectrical EngineeringEngineeringHigh Temperature MaterialsDurability Performance	2005	26
Reliability testing and data analysis of lead‐free solder joints for high‐density packages John H. Lau, Nick Hoo, Rob Horsley, Soldering and Surface Mount Technology ReliabilityAdvanced PackagingElectrical EngineeringReliability EngineeringEngineering	2004	25
Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards) John H. Lau, Walter Dauksher Journal of Electronic Packaging EngineeringPrinted Circuit Boards1657-Pin Ccga PackageAdvanced Packaging (Semiconductors)Corrosion	2005	21
A Finite-Element-Based Solder-Joint Fatigue-Life Prediction Methodology for Sn–Ag–Cu Ball-Grid-Array Packages Walter Dauksher, John H. Lau IEEE Transactions on Device and Materials Reliability EngineeringLife PredictionMechanical EngineeringFinite-element-based Modeling MethodologyDeterioration Modeling	2009	20
Failure analysis of lead‐free solder joints for high‐density packages John H. Lau, Dongkai Shangguan, Todd Castello, Soldering and Surface Mount Technology Materials ScienceAdvanced PackagingElectrical EngineeringTemperature CyclingEngineering	2004	18

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