Concepedia

Joe Smetana

JS

4

Publications

113

Citations

4

H-Index

2004

Active since

Affiliations

Agilent Technologies (United States)(Current)

Endicott College

Flex (United States)

IBM (United States)

Joe Smetana is an author at Agilent Technologies (United States) specializing in electronic packaging, advanced packaging, and engineering.

Top concepts

EngineeringAdvanced PackagingElectronic PackagingMaterial ScienceElectrical EngineeringMechanical EngineeringMechanics Of MaterialsReliability EngineeringReliabilityData Analysis

Publications per year

2004–2004

4

Publications

4

Design for lead‐free solder joint reliability of high‐density packages

John H. Lau, Walter Dauksher, Joe Smetana et al. · Soldering and Surface Mount Technology · 2004 · 58 citations

Materials Science, Advanced Packaging, Electrical Engineering +14

Reliability testing and data analysis of lead‐free solder joints for high‐density packages

John H. Lau, Nick Hoo, Rob Horsley et al. · Soldering and Surface Mount Technology · 2004 · 25 citations

Reliability, Advanced Packaging, Electrical Engineering +15

Failure analysis of lead‐free solder joints for high‐density packages

John H. Lau, Dongkai Shangguan, Todd Castello et al. · Soldering and Surface Mount Technology · 2004 · 18 citations

Materials Science, Advanced Packaging, Electrical Engineering +11

Design, materials and process for lead‐free assembly of high‐density packages

Joe Smetana, Rob Horsley, John H. Lau et al. · Soldering and Surface Mount Technology · 2004 · 12 citations

Materials Science, Materials Engineering, Advanced Packaging +14

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