Concepedia

Nick Hoo

NH

4

Publications

138

Citations

4

H-Index

2004

Active since

Affiliations

International Tin Research Institute(Current)

Flex (United States)

Endicott College

Agilent Technologies (United States)

Nick Hoo is an author at International Tin Research Institute specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingElectrical EngineeringMicroelectronicsAdvanced PackagingCorrosionReliabilityData AnalysisHeat Transfer

Publications per year

2004–2012

4

Publications

4

Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

Aleš Kroupa, Dag Andersson, Nick Hoo et al. · Journal of Materials Engineering and Performance · 2012 · 85 citations

Materials Science, Electrical Engineering, Current Problems +9

Reliability testing and data analysis of lead‐free solder joints for high‐density packages

John H. Lau, Nick Hoo, Rob Horsley et al. · Soldering and Surface Mount Technology · 2004 · 25 citations

Reliability, Advanced Packaging, Electrical Engineering +15

Failure analysis of lead‐free solder joints for high‐density packages

John H. Lau, Dongkai Shangguan, Todd Castello et al. · Soldering and Surface Mount Technology · 2004 · 18 citations

Materials Science, Advanced Packaging, Electrical Engineering +11

Intermetallic phase detection in lead-free solders using synchrotron x-ray diffraction

G.J. Jackson, Hua Lu, R. Durairaj et al. · Journal of Electronic Materials · 2004 · 10 citations

Materials Science, Engineering, X-ray Diffraction +4

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