Hua Lu

Failure and Reliability Analysis of a SiC Power Module Based on Stress Comparison to a Si Device

Borong Hu, Jose Ortiz Gonzalez, Li Ran et al. · IEEE Transactions on Device and Materials Reliability · 2017 · 190 citations

Reliability, Electrical Engineering, Reliability Engineering +15

Design for reliability of power electronics modules

Hua Lu, C. Bailey, Chunyan Yin · Microelectronics Reliability · 2009 · 182 citations

Reliability, Electrical Engineering, Reliability Engineering +6

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications

C.Y Yin, M.O. Alam, Y.C. Chan et al. · Microelectronics Reliability · 2003 · 57 citations

Flip Chip, Electrical Engineering, Wafer Scale Processing +12

Lifetime Prediction for Power Electronics Module Substrate Mount-down Solder Interconnect

Hua Lu, T. Tilford, C. Bailey et al. · 2007 · 51 citations

Engineering, Mechanical Engineering, Large Solder Area +22

Wire Bond Reliability for Power Electronic Modules - Effect of Bonding Temperature

Wei-Sun Loh, Martin Corfield, Hua Lu et al. · 2007 · 50 citations

Aluminium Nitride, Power Electronic Modules, Engineering +24