Concepedia

T. Tilford

TT

17

Publications

386

Citations

13

H-Index

2006

Active since

Affiliations

University of Greenwich(Current)

Heriot-Watt University

Fraunhofer Institute for Manufacturing Engineering and Automation

University of Sheffield

Heriot-Watt University Malaysia

T. Tilford is an author at University of Greenwich specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringMicroelectronicsMechanical EngineeringMaterial ScienceMicrofabricationReliability Engineering3D PrintingHeat Transfer

Publications per year

2006–2024

17

Publications

17

Lifetime Prediction for Power Electronics Module Substrate Mount-down Solder Interconnect

Hua Lu, T. Tilford, C. Bailey et al. · 2007 · 51 citations

Engineering, Mechanical Engineering, Large Solder Area +22

Wire Bond Reliability for Power Electronic Modules - Effect of Bonding Temperature

Wei-Sun Loh, Martin Corfield, Hua Lu et al. · 2007 · 50 citations

Aluminium Nitride, Power Electronic Modules, Engineering +24

Design, manufacture and test for reliable 3D printed electronics packaging

T. Tilford, Stoyan Stoyanov, Jessica Braun et al. · Microelectronics Reliability · 2018 · 39 citations

Industrial Design, Chip-scale Package, Engineering +9

Microwave Modeling and Validation in Food Thawing Applications

T. Tilford, Ed Baginski, Jasper Kelder et al. · Journal of Microwave Power and Electromagnetic Energy · 2006 · 37 citations

Microwave Device Modeling, Engineering, Thermal Engineering +14

Data driven approach to quality assessment of 3D printed electronic products

Georgios Tourloukis, Stoyan Stoyanov, T. Tilford et al. · 2015 · 26 citations

Printing Technology, Engineering, Industrial Engineering +18

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