Concepedia

Stoyan Stoyanov

SS

Statistics

Publications

29

Citations

619

H-Index

17

Active since

2002

Affiliations

University of Greenwich(Current)

RWTH Aachen University

Fraunhofer Institute for Laser Technology

Imperial College London

Fraunhofer Institute for Manufacturing Engineering and Automation

Stoyan Stoyanov is an author at University of Greenwich specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

EngineeringMechanical Engineering3D PrintingSystems EngineeringElectronic PackagingMaterial ScienceComputer EngineeringComputer-aided DesignMicroelectronicsIndustrial Design

Publications per year

2002–2024

29

Publications

29

A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

Yilun Xu, Jingwei Xian, Stoyan Stoyanov et al. · International Journal of Plasticity · 2022 · 60 citations · Full text

Friction Welding, Engineering, Mechanical Engineering +17

The role of microstructure in the thermal fatigue of solder joints

Jingwei Xian, Yilun Xu, Stoyan Stoyanov et al. · Nature Communications · 2024 · 48 citations · Full text

Design, manufacture and test for reliable 3D printed electronics packaging

T. Tilford, Stoyan Stoyanov, Jessica Braun et al. · Microelectronics Reliability · 2018 · 39 citations

Industrial Design, Chip-scale Package, Engineering +9

Prognostics and Health Monitoring of High Power LED

Thamo Sutharssan, Stoyan Stoyanov, C. Bailey et al. · Micromachines · 2012 · 38 citations · Full text

Monitoring Technology, Electrical Engineering, Real-time Monitoring +15

Optimisation modelling for thermal fatigue reliability of lead‐free interconnects in fine‐pitch flip‐chip packaging

Stoyan Stoyanov, C. Bailey, Marc P. Y. Desmulliez · Soldering and Surface Mount Technology · 2009 · 32 citations

Engineering, Mechanical Engineering, Computer-aided Design +20

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