Jingwei Xian

Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections

Jingwei Xian, S. Belyakov, M. Ollivier et al. · Acta Materialia · 2017 · 113 citations

Materials Science, Materials Engineering, Engineering +6

Nucleation of tin on the Cu6Sn5 layer in electronic interconnections

Jingwei Xian, Zhaolong Ma, S. Belyakov et al. · Acta Materialia · 2016 · 81 citations

Materials Engineering, Materials Science, Stanene +10

Nucleation and growth crystallography of Al8Mn5 on B2-Al(Mn,Fe) in AZ91 magnesium alloys

Guang Zeng, Jingwei Xian, C.M. Gourlay · Acta Materialia · 2018 · 80 citations

Materials Science, Materials Engineering, Engineering +7

Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys

Ying Cui, Jingwei Xian, A. Zois et al. · Acta Materialia · 2023 · 71 citations · Full text

Engineering, Large Ag3sn Plates, Chemistry +16

A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

Yilun Xu, Jingwei Xian, Stoyan Stoyanov et al. · International Journal of Plasticity · 2022 · 60 citations · Full text

Friction Welding, Engineering, Mechanical Engineering +17