G.J. Jackson

Correlation of solder paste rheology with computational simulations of the stencil printing process

R. Durairaj, G.J. Jackson, N.N. Ekere et al. · Soldering and Surface Mount Technology · 2002 · 52 citations

Engineering, Mechanical Engineering, Paste Characterisation +18

Sub process challenges in ultra fine pitch stencil printing of type‐6 and type‐7 Pb‐free solder pastes for flip chip assembly applications

G.J. Jackson, M.W. Hendriksen, Robert W. Kay et al. · Soldering and Surface Mount Technology · 2005 · 27 citations

Materials Science, Stencil Printing, Engineering +11

Stencil Printing Technology for Wafer Level Bumping at sub-100-Micron Pitch Using Pb-Free Alloys

Robert W. Kay, E. de Gourcuff, Marc P. Y. Desmulliez et al. · 2005 · 19 citations

Engineering, Mechanical Engineering, Wafer Scale Processing +17

Characterisation of lead-free solder pastes for low cost flip-chip bumping

G.J. Jackson, R. Durairaj, N.N. Ekere · 2003 · 18 citations

Materials Science, Materials Engineering, New Material +15

Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip

G.J. Jackson, M.W. Hendriksen, R. Durairaj et al. · 2004 · 16 citations

Materials Science, Flip Chip, Engineering +4