M.W. Hendriksen

Sub process challenges in ultra fine pitch stencil printing of type‐6 and type‐7 Pb‐free solder pastes for flip chip assembly applications

G.J. Jackson, M.W. Hendriksen, Robert W. Kay et al. · Soldering and Surface Mount Technology · 2005 · 27 citations

Materials Science, Stencil Printing, Engineering +11

Electrically Conductive and Highly Stretchable Piezoresistive Polymer Nanocomposites via Oxidative Chemical Vapor Deposition

Adrivit Mukherjee, Afshin Dianatdar, Magdalena Z. Gładysz et al. · ACS Applied Materials & Interfaces · 2023 · 25 citations · Full text

Electrical Resistance, Engineering, Responsive Polymers +18

Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip

G.J. Jackson, M.W. Hendriksen, R. Durairaj et al. · 2004 · 16 citations

Materials Science, Flip Chip, Engineering +4

Low temperature flip-chip packaging based on screen printing technology

Robert W. Kay, Marc P. Y. Desmulliez, C. Bailey et al. · 2003 · 11 citations

Mat21 Project, Engineering, Screen Printing Technology +17